1.)S.E.C.C. Package Type.S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
2.)S.E.C.C.2 Package Type.The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).
3.)S.E.P. Package Type.S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.
4.)PPGA Package Type.PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
5.)PGA Package Type.PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel 
plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins
plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins
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